Connector and communications device

ABSTRACT

A connector (100) and a communications device is disclosed. The connector includes a connector body (41) and three connecting ends disposed on the connector body. M signal interfaces (51a) inside a first connecting end (42) are in communication with M signal interfaces (51b) inside a second connecting end (43) in a one-to-one correspondence. The first connecting end is connected to a backplane connector (32) on a backplane (31). The second connecting end is connected to one end (45a) of a transmission cable (45), and the other end (45b) of the transmission cable is connected to a communications component (46) on a target board (33a). The backplane is configured to implement communication between X boards (33), and the target board is any one of X boards, where M≥1 and X≥1. A third connecting end (44) is configured to secure the connector body to the target board.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/393,630, filed on Apr. 24, 2019, which is a continuation ofInternational Application No. PCT/CN2017/081548, filed on Apr. 22, 2017.The International Application claims priority to Chinese PatentApplication No. 201611029644.9, filed on Nov. 14, 2016. All of theaforementioned patent applications are hereby incorporated by referencein their entireties.

TECHNICAL FIELD

The present disclosure relates to the field of information technologies,and in particular, to a connector and a communications device.

BACKGROUND

A backplane is a core part of a frame-shaped communications device. Thebackplane and a plurality of boards are connected to each other, so thatsignal interconnection between different boards can be implemented. Asshown in FIG. 1, for a conventional frame-shaped communications device,a board 11 is connected to a backplane 13 by using a backplane connector12 (the backplane connector 12 includes a first backplane connector 12 adisposed on the board 11 and a second backplane connector 12 b disposedon the backplane 13). Components such as a chip 14 are disposed on theboard 11. When needing to transmit an electrical signal to a componenton another board, the chip 14 may be in communication with the backplaneconnector 12 by using a cabling 15 on the board 11, and then transmitsthe electrical signal to the backplane 13 by using the backplaneconnector 12. Finally, the backplane 13 transmits the electrical signalto the another board.

If a high speed cable (a transmission loss of the high speed cable isless than a transmission loss of the cabling 15) is used to directlyconnect the chip 14 to the backplane connector 12, a transmission lossof the electrical signal can be reduced. Based on this, to secure thehigh speed cable to the board to implement communication between thechip 14 and the backplane 13, as shown in FIG. 2, a transition connector21 may be added on the board 11, and cable connectors 23 are added ontwo ends of the high speed cable 22. A cable connector 23 on one end isconnected to the chip 14, and the cable connector 23 on the other end isconnected to the transition connector 21. The transition connector 21imports a received high speed electrical signal to the cabling 15 insidethe board 11. The electrical signal finally reaches the backplane 13 byusing the backplane connector 12.

That is, in a connection structure shown in FIG. 2, the electricalsignal sent by the chip 14 to the backplane 13 is first transmitted onthe high speed cable 22, then is guided by the transition connector 21,and is transmitted to the backplane 13 on the cabling 15 inside theboard 11. A transmission loss of the electrical signal can be reducedwhen the electrical signal is transmitted on the high speed cable 22.However, because the transition connector 21 is added inside the board11, a crosstalk phenomenon may occur when the electrical signal istransmitted on neighboring signal lines inside the transition connector21. In addition, because a part of a transmission path of the electricalsignal is on the cabling 15, a transmission loss resulted from thecabling 15 cannot be reduced.

SUMMARY

Embodiments of the present disclosure provide a connector and acommunications device, to eliminate a crosstalk phenomenon resulted fromaddition of a transition connector and reduce a transmission loss of anelectrical signal in a transmission process.

The following technical solutions are used in the embodiments of thepresent disclosure to achieve the foregoing objectives.

According to a first aspect, an embodiment of the present disclosureprovides a connector, including a connector body and three connectingends disposed on the connector body, where M (M≥1) signal interfacesinside a first connecting end are in communication with M signalinterfaces inside a second connecting end in a one-to-onecorrespondence, the first connecting end is connected to a backplaneconnector on a backplane, the second connecting end is connected to oneend of a transmission cable, the other end of the transmission cable isconnected to a communications component on a target board, the backplaneis configured to implement communication between X boards, and thetarget board is any one of X (X≥1) boards; and a third connecting end isconfigured to secure the connector body to the target board. In thisway, an electrical signal sent by the communications component on thetarget board may be directly transmitted to the backplane by using thetransmission cable and the connector without passing through a cablingdisposed inside the target board, and a transmission loss of thetransmission cable is usually less than a transmission loss of thecabling inside the target board. Therefore, a transmission loss of theelectrical signal in a transmission process can be reduced.

In addition, the electrical signal on the transmission cable is directlytransmitted to the backplane by using the connector, and the electricalsignal does not need to be guided from the transmission cable to thecabling inside the target board by using a transition connector.Therefore, additional crosstalk that occurs because the electricalsignal is guided to the cabling inside the board by using the transitionconnector compared with other approaches also can be avoided.

In one embodiment, the signal interface may be a pin-shaped signalinterface, a connecting finger-shaped conductive contact, or a ball gridarray package-shaped signal interface.

In one embodiment, inside the connector body, M signal pins are disposedthroughout the first connecting end and the second connecting end, andtwo ends of each signal pin are respectively used as a signal interfaceinside the first connecting end and a signal interface inside the secondconnecting end.

In one embodiment, a package substrate is disposed inside the connectorbody, M conducting wires are disposed inside the package substrate, oneend of each conducting wire is connected to one signal interface insidethe first connecting end, and the other end of the conducting wire isconnected to one signal interface inside the second connecting end.

In one embodiment, a grounding pin is disposed inside each of the firstconnecting end, the second connecting end, and the third connecting end,where the grounding pin of the first connecting end is in communicationwith the grounding pin of the third connecting end; and the groundingpin of the second connecting end is in communication with the groundingpin of the third connecting end, so that the electrical signal forms acomplete loop in the transmission process. In addition, after thegrounding pin of the first connecting end and the grounding pin of thesecond connecting end are grounded, a unified reference plane may beprovided for the electrical signal, so that the electrical signalmaintains a consistent and continuous impedance in the transmissionprocess.

In one embodiment, the grounding pin of the third connecting end issecured to the target board through a crimped connection, or thegrounding pin of the third connecting end is secured to the target boardthrough a welded connection.

In one embodiment, a first cable head and a second cable head arerespectively disposed on two ends of the transmission cable, where thetransmission cable is connected to the second connecting end by usingthe first cable head, and the transmission cable is connected to thecommunications component by using the second cable head.

In one embodiment, the M signal interfaces inside the second connectingend constitute N input ends, and each input end includes at least onesignal interface, where N≥1, N communications components are disposed onthe target board, and each communications component is connected to aninput end by using a transmission cable. In this way, each input end maybe connected to a communications component on the target board by usingthe transmission cable. In this case, the N communications components onthe target board all may directly transmit the electrical signal to thebackplane by using the connector, thereby greatly reducing thetransmission loss of the electrical signal in the transmission process.

In one embodiment, the connector body is a housing supporting and/orsecuring the three connecting ends.

In one embodiment, a PCB circuit is disposed on the target board, andthe PCB circuit is configured to complete a preset communicationfunction.

According to a second aspect, an embodiment of the present disclosureprovides a communications device, including a backplane and X boardsconnected to the backplane, where a communications component is disposedon a target board, the communications component is connected to thebackplane by using any one of the foregoing connectors, and the targetboard is any one of the X boards.

In one embodiment, a first connecting end of the connector is connectedto a backplane connector of the backplane; a second connecting end ofthe connector is connected to one end of a transmission cable, and theother end of the transmission cable is connected to the communicationscomponent; and a third connecting end of the connector is connected tothe target board.

In one embodiment, the third connecting end of the connector isconnected to the target board by using a daughter board, and thedaughter board is a subboard of the target board and is configured toimplement at least one communication function of the target board. Inthis way, the target board may implement different functions bydisposing different daughter boards.

In one embodiment, the communications component may be at least one of achip, a processor, and a memory.

In the present disclosure, a name of the connector or the communicationsdevice does not constitute a limitation on the device itself. Duringactual implementation, these devices may have other names, provided thatfunctions of the devices are similar to those in the present disclosureand fall within the scope defined by the following claims and equivalenttechnologies of the present disclosure.

These aspects or other aspects of the present disclosure are moreconcise and understandable in the description of the followingembodiments.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram 1 of a connection structure of a board anda backplane in the prior art;

FIG. 2 is a schematic diagram 2 of a connection structure of a board anda backplane in the prior art;

FIG. 3 is a schematic diagram of an internal structure of acommunications device according to an embodiment of the presentdisclosure;

FIG. 4 is a schematic structural diagram 1 of a connector according toan embodiment of the present disclosure;

FIG. 5 is a schematic diagram 1 of a connection structure of a targetboard and a backplane according to an embodiment of the presentdisclosure;

FIG. 6 is a schematic diagram 1 of an internal structure of a connectoraccording to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram 2 of an internal structure of a connectoraccording to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a transmission cableaccording to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram 2 of a connector according toan embodiment of the present disclosure; and

FIG. 10 is a schematic diagram 2 of a connection structure of a targetboard and a backplane according to an embodiment of the presentdisclosure.

DESCRIPTION OF EMBODIMENTS

The following describes the technical solutions in the embodiments ofthe present disclosure in detail with reference to the accompanyingdrawings in the embodiments of the present disclosure. Apparently, thedescribed embodiments are merely some but not all of the embodiments ofthe present disclosure.

In addition, the terms “first” and “second” are merely intended for apurpose of description, and shall not be understood as an indication orimplication of relative importance or implicit indication of a quantityof indicated technical features. Therefore, a feature restricted by“first” or “second” may explicitly indicate or implicitly include one ormore such features. In the descriptions in the present disclosure,unless otherwise provided, “a plurality of” means two or more than two.

An embodiment of the present disclosure provides a connector, which maybe applied to any communications device whose X (X≥1) boards need to beconnected by using a backplane for communication. FIG. 3 is a schematicdiagram of a possible internal structure of the communications device. Aplurality of backplane connectors 32 that are arranged in an array aredisposed on a backplane 31. Different boards 33 may be connected tocorresponding backplane connectors 32 by using a connector 100 providedin this embodiment of the present disclosure, so that the differentboards 33 are inserted on the backplane 31. In this case, communicationscomponents (for example, a chip) on the different boards 33 canimplement communication by using the backplane 31.

Based on the schematic diagram of the internal structure of thecommunications device shown in FIG. 3, the following describes theconnector 100 provided in this embodiment of the present disclosure indetail by using a connection manner of a target board and the backplane31 as an example.

The target board is any one of the X boards 33. A printed circuit board(PCB) circuit is disposed on the target board. The PCB circuit may beconfigured to complete a preset communication function, for example,packet parsing, data sending, and data receiving. This is not limited inthis embodiment of the present disclosure.

Further, as shown in FIG. 4, the connector 100 includes a connector body41 and three connecting ends disposed on the connector body 41 (that is,a first connecting end 42, a second connecting end 43, and a thirdconnecting end 44). The connector body 41 is a housing supporting and/orsecuring the three connecting ends.

As shown in FIG. 5, the first connecting end 42 is connected to thebackplane connector 32 on the backplane 31; the second connecting end 43is connected to one end of the transmission cable 45 (that is, 45 ashown in FIG. 5), and the other end of the transmission cable 45 (thatis, 45 b shown in FIG. 5) is connected to a communications component 46on a target board 33 a; and the third connecting end 44 (not shown inFIG. 5) is configured to secure the connector body 41 to the targetboard 33 a.

As shown in FIG. 6, M signal interfaces 51 a inside the first connectingend 42 are in communication with M signal interfaces 51 b inside thesecond connecting end 43 in a one-to-one correspondence, where M≥1.

In this way, after an electrical signal sent by the communicationscomponent 46 passes through the transmission cable 45, the electricalsignal may be directly transmitted from a signal interface 51 b insidethe second connecting end 43 to a signal interface 51 a inside the firstconnecting end 42, and then is transmitted to the backplane 31 by usingthe backplane connector 32. That is, the electrical signal sent by thecommunications component 46 on the target board 33 a may be directlytransmitted to the backplane 31 by using the transmission cable 45 andthe connector 100 without passing through a cabling disposed inside thetarget board 33 a. A transmission loss of the transmission cable 45 isusually less than a transmission loss of the cabling inside the targetboard 33 a. Therefore, a transmission loss of the electrical signal in atransmission process can be reduced. In addition, the electrical signalon the transmission cable 45 is directly transmitted to the backplane 31by using the connector 100, and the electrical signal does not need tobe guided from the transmission cable 45 to the cabling inside thetarget board 33 a by using a transition connector. Therefore, additionalcrosstalk that occurs because the electrical signal is guided to thecabling inside the board by using the transition connector compared withother approaches also can be avoided.

It should be noted that the signal interface 51 a inside the firstconnecting end 42 and the signal interface 51 b inside the secondconnecting end 43 may also be referred to as a pin, and an appearancethereof may have various shapes. For example, the signal interface 51 aand signal interface 51 b may be further a pin-shaped signal interface,or may be a connecting finger-shaped conductive contact, or may be aball grid array (BGA)-shaped signal interface. This is not limited inthis embodiment of the present disclosure.

For example, the signal interface 51 a and signal interface 51 b arepin-shaped signal interfaces. Still as shown in FIG. 6, inside theconnector body 41, M signal pins 52 are disposed throughout the firstconnecting end 42 and the second connecting end 43, and two ends of eachsignal pin 52 are respectively used as a signal interface 51 a insidethe first connecting end 42 and a signal interface 51 b inside thesecond connecting end 43. In this way, after receiving the electricalsignal from the communications component 46, the signal interface 51 amay directly transmit the electrical signal to signal interface 51 b byusing the signal pin 52, and then signal interface 51 b transmits theelectrical signal to the backplane connector 32 on the backplane 31.

Certainly, a package substrate similar to the PCB may alternatively bedisposed inside the connector body 41. In this case, M conducting wiresmay be disposed inside the package substrate. One end of each conductingwire is connected to one signal interface 51 a inside the firstconnecting end 42, and the other end of the conducting wire may beconnected to one signal interface 51 b inside the second connecting end43, so that the M signal interfaces 51 a inside the first connecting end42 are in communication with the M signal interfaces 51 b inside thesecond connecting end 43 in a one-to-one correspondence. This is notlimited in this embodiment of the present disclosure.

In addition, it should be noted that in addition to the M signalinterfaces 51 a, the first connecting end 42 may further include anothersignal interface. Similarly, in addition to the M signal interfaces 51b, the second connecting end 43 may further include another signalinterface. In this case, when a quantity of signal interfaces inside thefirst connecting end 42 is inconsistent with a quantity of signalinterfaces inside the second connecting end 43, some signal interfacesmay be idle. For example, 10*10 signal interfaces 51 a are disposedinside the first connecting end 42, and 8*8 signal interfaces 51 b aredisposed inside the second connecting end 43. In this case, 8*8 signalinterfaces 51 a inside the first connecting end 42 are in communicationwith the 8*8 signal interfaces 51 b inside the second connecting end 43in a one-to-one correspondence, and remaining 36 (10*10-8*8) signalinterfaces 51 a inside the first connecting end 42 are idle.

Further, as shown in FIG. 7, a grounding pin 61 may be disposed insideeach of the first connecting end 42, the second connecting end 43, andthe third connecting end 44. The grounding pin of the first connectingend 42 may be in communication with the grounding pin 61 of the thirdconnecting end 44 by using a grounding pin; and the grounding pin 61 ofthe second connecting end 43 may also be in communication with thegrounding pin 61 of the third connecting end 44 by using a groundingpin.

The grounding pin 61 inside the first connecting end 42 and thegrounding pin 61 inside the second connecting end 43 are separately incommunication with the grounding pin 61 of the third connecting end 44,so that the electrical signal may form a complete loop in thetransmission process. In addition, after the grounding pin 61 inside thefirst connecting end 42 and the grounding pin 61 inside the secondconnecting end 43 are grounded, a unified reference plane may beprovided for the electrical signal, so that the electrical signalmaintains a consistent and continuous impedance in the transmissionprocess, thereby increasing signal integrity (SI) of the electricalsignal in the transmission process, and reducing electromagneticinterference (EMI) of the electrical signal in the transmission process.

It should be noted that a grounding pin 61 inside the first connectingend 42 and a grounding pin 61 inside the second connecting end 43 areused as an example, the grounding pin inside the first connecting end 42and the grounding pin inside the second connecting end 43 may beconnected to different grounding pins inside the third connecting end44, or may be connected to a same grounding pin inside the thirdconnecting end 44. This is not limited in this embodiment of the presentdisclosure.

Further, the grounding pin 61 of the third connecting end 44 may besecured to the target board 33 a through a crimped connection, or may besecured to the target board 33 a through a welded connection. This isnot limited in this embodiment of the present disclosure.

In addition, the transmission cable 45 may be further high-speed cablesof various types, such as quad small form-factor pluggable (QSFP), quadsmall form-factor pluggable plus (QSFP+), extended capacity form-factorpluggable (CXP), and serial attached SCSI (SAS). This is not limited inthis embodiment of the present disclosure.

Further, as shown in FIG. 8, a first cable head 45 a and a second cablehead 45 b are respectively disposed on two ends of the transmissioncable 45. In this way, still as shown in FIG. 5, the transmission cable45 may be connected to the second connecting end 43 by using the firstcable head 45 a, and may be connected to the communications component 46by using the second cable head 45 b.

For example, the first cable head 45 a and the second cable head 45 bmay be further connecting finger connectors. This is not limited in thisembodiment of the present disclosure.

Further, as shown in FIG. 9, the M signal interfaces 51 b inside thesecond connecting end 43 may constitute N (N≥1) input ends 62 (eachinput end 62 includes at least one signal interface 51 b). In this way,each input end 62 may be connected to a communications component 46 onthe target board 33 a by using a transmission cable 45. In this case,the N communications components 46 on the target board 33 a all candirectly transmit the electrical signal to the backplane 31 by using theconnector 100, thereby greatly reducing the transmission loss of theelectrical signal in the transmission process.

Based on any one of the connectors 100 shown in the foregoingembodiments, an embodiment of the present disclosure further provides acommunications device. The communications device includes a backplaneand X boards connected to the backplane. A communications component isdisposed on a target board (the target board is any one of the Xboards). The communications component is connected to the backplane byusing any one of the foregoing connectors 100.

FIG. 5 is still used as an example, and is a schematic diagram of aconnection structure between a target board 33 a and a backplane 31inside the communications device. A first connecting end 42 of theconnector 100 is connected to a backplane connector 32 on a backplane31, a second connecting end 43 of the connector 100 is connected to oneend of a transmission cable 45, the other end of the transmission cable45 is connected to the communications component 46 on the target board33 a, and a third connecting end 43 of the connector 100 is configuredto secure a connector body 41 to the target board 33 a.

A signal interface 51 a inside the first connecting end 42 connected tothe backplane connector 32 may be in a curved female form when a pininside the backplane connector 32 is in a straight male form. The signalinterface 51 a inside the first connecting end 42 connected to thebackplane connector 32 may be in a straight male form when the pininside the backplane connector 32 is in a curved female form.

In addition, M signal interfaces 51 a inside the first connecting end 42are in communication with M signal interfaces 51 b inside the secondconnecting end 43 in a one-to-one correspondence, where M≥1.

In this way, the communications component 46 may transmit, to thetransmission cable 45 by using a directly extended high speed interface,an electrical signal needing to be transmitted, and then thetransmission cable 45 directly transmits the electrical signal to thebackplane connector 32 by using the connector 100 to reach the backplane31, thereby reducing a transmission loss and crosstalk of the electricalsignal in a transmission process.

Further, as shown in FIG. 10, when a daughter board 63 (the daughterboard 63 is a subboard of a target board 33 a, and may be configured toimplement at least one function of the target board 33 a) is disposed onthe target board 33 a. The foregoing third connecting end 44 may bedisposed on the daughter board 63, that is, connected to the targetboard 33 a by using the daughter board 63. A first connecting end 42 isstill connected to a backplane connector 32 on a backplane 31, and asecond connecting end 43 is still connected to a transmission cable 45.

In this way, the target board 33 a may implement different communicationfunctions by disposing different daughter boards 63. In addition,compared with the target board 33 a, as an field replaceable unit (FRU),the daughter board 63 is more flexible and is more easily deployed, andmaintenance costs are lower.

In addition, the communications component may be a chip, a processor, ora functional module having a particular function. The processor may be acentral processing unit (CPU), a general-purpose processor, a digitalsignal processor (DSP), an application-specific integrated circuit(ASIC), a field programmable gate array (FPGA) or another programmablelogic device, a transistor logic device, a hardware component, or anycombination thereof. The processor may implement or execute variousexamples of logical blocks, modules, and circuits that are describedwith reference to the contents disclosed in the present disclosure. Theprocessor may also be a combination of computing functions, for example,includes a combination of one or more microprocessors or a combinationof a digital signal processor (DSP) and a microprocessor. This is notlimited in this embodiment of the present disclosure.

It should be noted that the communication function implemented by thetarget board 33 a or the daughter board 63 in the foregoing embodimentmay be implemented by a processor executing a corresponding softwareinstruction. The software instruction may include a correspondingsoftware module. The software module may be stored in a random accessmemory (RAM), a flash memory, a read-only memory (ROM), an erasableprogrammable read-only memory (EPROM), an electrically erasableprogrammable read-only memory (EEPROM), a register, a hard disk, aremovable hard disk, a compact disc read-only memory (CD-ROM), or astorage medium in any other forms well-known in the art. A storagemedium used as an example is coupled to the processor, so that theprocessor can read information from the storage medium, and can writeinformation into the storage medium. Certainly, the storage medium maybe a part of the processor. This is not limited in this embodiment ofthe present disclosure.

A person of skill in the art should be aware that in one or more of theforegoing examples, the functions described in the present disclosuremay be implemented by using hardware, software, firmware, or anycombination thereof. These functions may be stored in acomputer-readable medium or transmitted as one or more instructions orcode in the computer-readable medium when this application isimplemented by software. The computer-readable medium includes acomputer storage medium and a communications medium, where thecommunications medium includes any medium that enables a computerprogram to be transmitted from one place to another. The storage mediummay be any available medium accessible to a general or dedicatedcomputer.

The objectives, technical solutions, and benefit effects of the presentdisclosure are further described in detail in the foregoing furtherembodiments. It should be understood that the foregoing descriptions aremerely further embodiments of the present disclosure, but are notintended to limit the protection scope of the present disclosure. Anymodification, equivalent replacement, or improvement made based on thetechnical solutions of the present disclosure shall fall within theprotection scope of the present disclosure.

What is claimed is:
 1. A communications device, comprising: X boards anda backplane, where X≥1; wherein a communications component disposed on atarget board is connected to the backplane using a connector, and thetarget board is any one of the X boards; wherein the connector comprisesa connector body and three ends disposed on the connector body, whereina first end of the three ends is connected to a backplane connector onthe backplane, a second end of the three ends is connected to thecommunications component on the target board by using a transmissioncable, wherein the first end is connected to the second end through Msignal pins inside the connector body, where M≥1; and wherein a thirdend of the three ends secures the connector body to the target board. 2.The communications device according to claim 1, wherein two ends of eachpin are respectively used as a signal interface inside the first end anda signal interface inside the second end.
 3. The communications deviceaccording to claim 1, wherein one end of the transmission cable isconnected to the second end in a pluggable manner, and the other end ofthe transmission cable is connected to the communications component in apluggable manner.
 4. The communications device according to claim 1,wherein the third end secures the connector body to the target boardthrough a crimped connection or a welded connection or in a pluggablemanner.
 5. The communications device according to claim 1, wherein thethird connecting end secures the connector body to the target boardthrough a daughter board.
 6. The communications device according toclaim 1, wherein a grounding pin is disposed inside each of the firstend and the second end.
 7. The communications device according to claim1, wherein the second end comprises N input ends, and each input endcomprises at least one signal interface, wherein N≥1, wherein Ncommunications components are disposed on the target board, and eachcommunications component is connected to an input end by using thetransmission cable.
 8. The communications device according to claim 1,wherein the communications component is a chip or a processor.
 9. Thecommunications device according to claim 8, wherein the processorcomprises at least one of the following: a central processing unit(CPU), a general-purpose processor, a digital signal processor (DSP), anapplication-specific integrated circuit (ASIC), a field programmablegate array (FPGA) or another programmable logic device, a transistorlogic device, or a hardware component.
 10. A server, comprising: atleast one board and a connector, wherein a communications componentdisposed on the at least one board is connected to a backplane using theconnector; wherein the connector comprises a connector body and threeends disposed on the connector body, wherein a first end of the threeends is connected to a backplane connector on the backplane, a secondend of the three ends is connected to the communications component usinga transmission cable, wherein the first end is connected to the secondend through M signal pins inside the connector body, M≥1, and wherein athird end of the three ends secures the connector body to the server.11. The server according to claim 10, wherein two ends of each pin arerespectively used as a signal interface inside the first end and asignal interface inside the second end.
 12. The server according toclaim 10, wherein one end of the transmission cable is connected to thesecond end in a pluggable manner, and the other end of the transmissioncable is connected to the communications component in a pluggablemanner.
 13. The server according to claim 10, wherein the third endsecures the connector body to the server through a crimped connection ora welded connection or in a pluggable manner.
 14. The server accordingto claim 10, wherein the third connecting end secures the connector bodyto the server through a daughter board.
 15. The server according toclaim 10, wherein a grounding pin is disposed inside each of the firstend and the second end.
 16. The server according to claim 10, whereinthe second end comprises N input ends, and each input end comprises atleast one signal interface, wherein N≥1, wherein N communicationscomponents are disposed on the board, and each communications componentis connected to an input end using the transmission cable.
 17. Theserver according to claim 10, wherein the communications component is achip or a processor.
 18. The server according to claim 17, wherein theprocessor comprises at least one of the following: a central processingunit (CPU), a general-purpose processor, a digital signal processor(DSP), an application-specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA) or another programmable logic device, atransistor logic device, or a hardware component.